ATI’s thin silicon handling tools are centered around our patented “light-touch” wafer separation and feeding technology. Our CTCv, automated wafer-stack to conveyor system, separates thin solar wafers from a coin-stack, and places them onto a conveyor at a high rate of speed.

Using ATI’s patented process, wafers are gently and quickly manipulated from a wafer stack without edge contact. Ati’s specially designed end effector removes one wafer at a time, without inflicting damage, and places it on any conveyor. Each CTCv separation unit is capable of 1000 wafers per hour throughput. Multiple units, integrated with an ATI custom staging conveyor, can provide throughput feed rates of 3 – 4 thousand wafers per hour to downstream processes.

They CTCv Systems improve product yield by eliminating wafer damage due to handling errors.
They are configurable for wafer sizes 125 - 200 mm, and can accept up to a 125 mm wafer stack.

Features:

• Proven to singulate and feed thin silicon wafers, down to 125 micron
• Configurable for multitude of wafer styles.
• Configurable for wafer sizes 125 - 200 mm
• Accepts up to 125 mm tall wafer stack
• Operator interface via control panel and process status light.
• Auto return feature facilitates easy reloading.

Specifications:

• Electrical:     240 VAC, 50 Hz, 12 Amps
• Electrical (USA):     110 VAC 60 Hz 20 Amps.
• CDA:     6 CFM @ 90 PSI     ( 170 lpm @ 620 kPa )
• Size:     38" wide x 30" deep x 56" tall     (965 mm x 762 mm x 1422 mm)